1              

Layer                                                 

1-30   Layers                                                                               

2

Base Material for PCB

FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High   Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material

3

Rang of finish baords Thickness

0.21-7.0mm

4

Max size of finish board

900MM*900MM

5

Minimum Linewidth

3mil (0.075mm)

6

Minimum Line space

3mil (0.075mm)

7

Min space between pad to pad

3mil (0.075mm)

8

Minimum hole diameter

0.10 mm

9

Min bonding pad diameter

10mil

10

Max proportion of drilling hole and board thickness

1:12.5

11

Minimum linewidth of Idents

4mil

12

Min Height of Idents

25mil

13

Finishing Treatment

HASL (Tin-Lead Free),  ENIG(Immersion Gold), Immersion Silver ,   Gold Plating (Flash Gold), OSP, etc.

14

Soldermask

Green, White, Red, Yellow, Black, Blue, transparent photosensitive   soldermask, Strippable soldermask.

15

Minimun thickness of soldermask

10um

16

Color of silk-screen

White, Black, Yellow ect.

17

E-Testing

100% E-Testing (High Voltage Testing);  Flying Probe Testing 

18

Other test

ImpedanceTesting,Resistance Testing, Microsection etc.,

19

Date file format

GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb   SERIES, ODB++

20

Special technological requirement

Blind & Buried Vias and High Thickness copper

21

Thickness of Copper

0.5-14oz (18-490um)

1

PRESS

2

10

Exposurer

5

2

X-Ray

1

11

Deveoloper

3

3

Brown-Oxidation

1

12

Auto V-cut

1

4

Drilling

13

13

AOI

2

5

Cutter

1

14

Routing

7

6

PTH

1

15

ETS

12

7

PAL

1

16

Fly Probe

4

8

PAT

1

17

YAMAHA SMT

3

9

Flash Gold

1

18

FUJI SMT

4

Sample

4

7

9

9

12

Mass production

7-9

10-12

13-15

16

20

Assembly

7-9

15

16

18

25